@article{oai:kumadai.repo.nii.ac.jp:00024008,
 author = {Morizono, Yasuhiro and Nakata, Takashi and 西田 , 稔 and Nishida, Minoru and Chiba, Akira and 森園 , 靖浩 and Morizono, Yasuhiro and 中田, 隆司 and 西田, 稔 and 千葉, 昂},
 issue = {1200},
 journal = {日本セラミックス協会学術論文誌},
 month = {Aug},
 note = {application/pdf, 論文(Article), Joining of Si_3N_4 to Si_3N_4 was carried out using Ag-Cu filler metal containing Ti, Zr, V and Nb as an active metal. Bonding treatment was performed at 1173 to 1473 K for 1h in a vacuum. The shear strengths of the joints brazed at 1173 to 1473 K using active filler metals containing Ti and Zr were 150 to 250 MPa. The fracture position of the joints after shear test was the filler metal or mixture of the filler metal and Si_3N_4. On the other hand, the average shear strengths of the joints brazed at 1373 K using active filler metals containing V and Nb were 144 and 163 MPa, respectively. The fracture position of the joints using theses filler metals was the interface between filler metal and Si_3N_4 in all cases. The active filler metals containing Ti and Zr yielded TiN and ZrN fine grains close to the Si_3N_4. No fine grains were observed in the joint using active filler metal containing V and coarse columnar grains os V_3Si wer observed. Therefore, it is concluded that the fine grains of the nitrides formed close to the Si_3N_4 is responsible for the substantial bonding between filler metal and Si_3N_4., http://ci.nii.ac.jp/naid/110002291207},
 pages = {810--815},
 title = {AG-Cuろうによりろう付けしたSi_3N_4/Si_3N_4接合体の接合特性と界面構造に及ぼす活性金属の影響},
 volume = {103},
 year = {1995},
 yomi = {ニシダ, ミノル and モリゾノ , ヤスヒロ}
}