{"created":"2023-06-19T09:16:22.253085+00:00","id":28808,"links":{},"metadata":{"_buckets":{"deposit":"4fa6cbc7-74b9-410c-b819-caa1fa051104"},"_deposit":{"created_by":1,"id":"28808","owners":[1],"pid":{"revision_id":0,"type":"depid","value":"28808"},"status":"published"},"_oai":{"id":"oai:kumadai.repo.nii.ac.jp:00028808","sets":["426:428"]},"author_link":["132131","132138","132133","132137","132132","147077"],"item_16_alternative_title_22":{"attribute_name":"その他の言語のタイトル","attribute_value_mlt":[{"subitem_alternative_title":"Ultraviolet-assisted polishing of 2 inch SiC substrate"}]},"item_16_alternative_title_23":{"attribute_name":"タイトル（ヨミ）","attribute_value_mlt":[{"subitem_alternative_title":"2 インチ SiC キバン ノ シガイコウ シエン ケンマ ニ カンスル ケンキュウ"}]},"item_16_biblio_info_6":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicIssueDates":{"bibliographicIssueDate":"2013-09-01","bibliographicIssueDateType":"Issued"},"bibliographicIssueNumber":"8","bibliographicPageEnd":"529","bibliographicPageStart":"524","bibliographicVolumeNumber":"57","bibliographic_titles":[{"bibliographic_title":"砥粒加工学会誌"}]}]},"item_16_creator_3":{"attribute_name":"別言語の著者","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"Sakamoto, Takeshi"}],"nameIdentifiers":[{"nameIdentifier":"132137","nameIdentifierScheme":"WEKO"}]},{"creatorNames":[{"creatorName":"Kubota, Akihisa"}],"nameIdentifiers":[{"nameIdentifier":"132138","nameIdentifierScheme":"WEKO"}]},{"creatorAffiliations":[{"affiliationNameIdentifiers":[{"affiliationNameIdentifier":"","affiliationNameIdentifierScheme":"ISNI","affiliationNameIdentifierURI":"http://www.isni.org/isni/"}],"affiliationNames":[{"affiliationName":"","affiliationNameLang":"ja"}]}],"creatorNames":[{"creatorName":"峠, 睦","creatorNameLang":"ja"},{"creatorName":"トウゲ, ムツミ","creatorNameLang":"ja-Kana"},{"creatorName":"Touge, Mutsumi","creatorNameLang":"en"}],"familyNames":[{"familyName":"峠","familyNameLang":"ja"},{"familyName":"トウゲ","familyNameLang":"ja-Kana"},{"familyName":"Touge","familyNameLang":"en"}],"givenNames":[{"givenName":"睦","givenNameLang":"ja"},{"givenName":"ムツミ","givenNameLang":"ja-Kana"},{"givenName":"Mutsumi","givenNameLang":"en"}],"nameIdentifiers":[{"nameIdentifier":"147077","nameIdentifierScheme":"WEKO"}]}]},"item_16_description_17":{"attribute_name":"フォーマット","attribute_value_mlt":[{"subitem_description":"application/pdf","subitem_description_type":"Other"}]},"item_16_description_46":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"subitem_description":"論文(Article)","subitem_description_type":"Other"}]},"item_16_description_5":{"attribute_name":"内容記述","attribute_value_mlt":[{"subitem_description":"シリコンカーバイド(SiC)基板は，その優れた特性から次世代パワーデバイス半導体への応用が期待されている．しかし，SiCは，ダイヤモンド，cBNに次ぐ硬度を有し，熱的，化学的に安定であるため，加工がきわめて困難な材料である．筆者らは，単結晶SiC基板や単結晶ダイヤモンド基板などの高硬度材料に対する鏡面加工技術として，紫外光照射を援用した超精密研磨技術を開発した．本報では，2インチサイズのSiC基板に対してAs-slice面に前加工を施し，その後紫外光支援研磨により最終仕上げを行う一連のプロセスを報告する．2段階のダイヤモンドラッピングによる前加工を行い，As-slice面から1hr以内で1μm程度の平坦性と，Ra:0.5nmの平滑性を持つ面に仕上げた．次に，紫外光支援研磨により，基板全体をRa:0.19nm～0.28nm，Rz:2.12nm～3.00nmのサブナノメートルオーダの超平滑な面に，削除率256nm/hrで仕上げることができた．","subitem_description_type":"Other"}]},"item_16_description_77":{"attribute_name":"URL","attribute_value_mlt":[{"subitem_description":"https://www.jstage.jst.go.jp/article/jsat/57/8/57_524/_article/-char/ja/","subitem_description_type":"Other"}]},"item_16_publisher_36":{"attribute_name":"出版者","attribute_value_mlt":[{"subitem_publisher":"砥粒加工学会"}]},"item_16_relation_11":{"attribute_name":"DOI","attribute_value_mlt":[{"subitem_relation_type":"isIdenticalTo","subitem_relation_type_id":{"subitem_relation_type_id_text":"10.11420/jsat.57.524","subitem_relation_type_select":"DOI"}}]},"item_16_source_id_7":{"attribute_name":"ISSN","attribute_value_mlt":[{"subitem_source_identifier":"09142703","subitem_source_identifier_type":"ISSN"}]},"item_16_source_id_9":{"attribute_name":"書誌レコードID","attribute_value_mlt":[{"subitem_source_identifier":"AN10192823","subitem_source_identifier_type":"NCID"}]},"item_16_subject_20":{"attribute_name":"日本十進分類法","attribute_value_mlt":[{"subitem_subject":"566.7","subitem_subject_scheme":"NDC"}]},"item_16_text_18":{"attribute_name":"形態","attribute_value_mlt":[{"subitem_text_value":"1471056 bytes"}]},"item_16_text_47":{"attribute_name":"資源タイプ・ローカル","attribute_value_mlt":[{"subitem_text_value":"雑誌掲載論文"}]},"item_16_text_48":{"attribute_name":"資源タイプ・NII","attribute_value_mlt":[{"subitem_text_value":"Journal Article"}]},"item_16_text_49":{"attribute_name":"資源タイプ・DCMI","attribute_value_mlt":[{"subitem_text_value":"text"}]},"item_16_text_50":{"attribute_name":"資源タイプ・ローカル表示コード","attribute_value_mlt":[{"subitem_text_value":"01"}]},"item_16_version_type_19":{"attribute_name":"著者版フラグ","attribute_value_mlt":[{"subitem_version_type":"VoR"}]},"item_creator":{"attribute_name":"著者","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"坂本, 武司"}],"nameIdentifiers":[{"nameIdentifier":"132131","nameIdentifierScheme":"WEKO"}]},{"creatorNames":[{"creatorName":"久保田, 章亀"}],"nameIdentifiers":[{"nameIdentifier":"132132","nameIdentifierScheme":"WEKO"}]},{"creatorNames":[{"creatorName":"峠, 睦"}],"nameIdentifiers":[{"nameIdentifier":"132133","nameIdentifierScheme":"WEKO"}]}]},"item_files":{"attribute_name":"ファイル情報","attribute_type":"file","attribute_value_mlt":[{"accessrole":"open_date","date":[{"dateType":"Available","dateValue":"2020-03-03"}],"displaytype":"detail","filename":"09142703v57n8_524-529.pdf","filesize":[{"value":"1.5 MB"}],"format":"application/pdf","licensetype":"license_note","mimetype":"application/pdf","url":{"label":"09142703v57n8_524-529.pdf","url":"https://kumadai.repo.nii.ac.jp/record/28808/files/09142703v57n8_524-529.pdf"},"version_id":"1ecffd4c-1533-435e-ac23-b7cf586c3918"}]},"item_keyword":{"attribute_name":"キーワード","attribute_value_mlt":[{"subitem_subject":"SiC","subitem_subject_scheme":"Other"},{"subitem_subject":"ultraprecision machining","subitem_subject_scheme":"Other"},{"subitem_subject":"ultraviolet-ray irradiation","subitem_subject_scheme":"Other"},{"subitem_subject":"X-ray photoelectron spectroscopy (XPS)","subitem_subject_scheme":"Other"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"jpn"}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourcetype":"journal article","resourceuri":"http://purl.org/coar/resource_type/c_6501"}]},"item_title":"2インチSiC基板の紫外光支援研磨に関する研究","item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"2インチSiC基板の紫外光支援研磨に関する研究"}]},"item_type_id":"16","owner":"1","path":["428"],"pubdate":{"attribute_name":"公開日","attribute_value":"2015-02-20"},"publish_date":"2015-02-20","publish_status":"0","recid":"28808","relation_version_is_last":true,"title":["2インチSiC基板の紫外光支援研磨に関する研究"],"weko_creator_id":"1","weko_shared_id":-1},"updated":"2023-09-26T02:46:32.373695+00:00"}