@article{oai:kumadai.repo.nii.ac.jp:00032717,
 author = {大野, 恭秀 and Ohno, Yasuhide},
 journal = {工学研究機器センター報告},
 month = {},
 pages = {8--8},
 title = {Application of 35μm Pitch Wire Bonding Technology to High Density Package},
 volume = {36},
 year = {2003},
 yomi = {オオノ, ヤスヒデ}
}